IS215UCVEM08B模块备件

IS215UCVEM08B

现场终端单元（FTU）是I/O模块中连接所有三个模块的部分
FIU到单个字段接口。FTU提供组故障保护开关和无源开关
信号调节、过压保护和EMI/RFI所需的部件
过滤。当安装在可信控制器或扩展器机箱中时，FTU现场连接器
与机箱后部连接的现场I/O电缆组件互连。
SmartSlot链路通过FTU从HIU传递到现场连接。这些信号
直接连接现场连接器，并与FTU上的I/O信号保持隔离。这个
SmartSlot链路是主模块和备用模块之间的智能连接，用于在模块更换期间进行协调。
1.2.现场接口单元（FIU）
现场接口单元（FIU）是模块中包含特定电路的部分
需要与特定类型的现场I/O信号接口。每个模块有三个
菲乌斯，一片一片。对于TMR 24 Vdc数字输出模块，FIU包含一级
输出开关结构和∑Δ输出电路
输出。另外两个∑Δ电路提供对外部磁场I/O的可选监控
电源电压。
可信TMR 24Vdc数字输出模块–40信道1.说明
罗克韦尔自动化出版物ICSTT-RM280N-EN-P14期5
FIU从HIU接收隔离电源，用于逻辑。FIU提供额外的功率
调节FIU电路所需的工作电压。隔离的6.25
Mbit/sec串行链路将每个FIU连接到其中一个HIU片。
金融情报室还测量一系列有助于监测的机载“内务”信号
模块的性能和操作条件。这些信号包括功率
电源电压、电流消耗、板上参考电压和板温度。
1.3.主机接口单元（HIU）
HIU是模块的模块间总线（IMB）的接入点。它还提供：
配电和本地可编程处理能力。HIU是整个系统的部分
I/O模块直接连接到IMB背板。HIU对于大多数高功率放大器来说是常见的
完整性I/O类型，并具有类型相关和产品范围通用功能。每个HIU
包含三个独立的切片，通常称为A、B和C。
三个片之间的所有互连都包含隔离，以帮助防止任何故障
切片之间的相互作用。每个切片被视为一个故障控制区域（FCR），如下所示：
一个切片上的故障对其他切片的操作没有影响。
HIU提供了系列中模块共有的以下服务：
•通过IMB与TMR处理器进行高速容错通信
界面
•片间FCR互连总线，以投票输入IMB数据并分发
向IMB输出I/O模块数据。
•与FIU片的电流隔离串行数据接口。
•双24 Vdc机箱电源电压和电源的冗余电源共享
HIU电路的逻辑功率调节。
•FIU片的磁隔离电源。
•模块状态指示灯的FPU串行数据接口。
•活动和备用模块之间的SmartSlot链路，用于在运行期间进行协调
模块更换。
•数字信号处理，以执行本地数据缩减和自我诊断。
•用于存储模块操作、配置和现场I/O的本地内存资源
数据
•车载内务管理，监控参考电压、电流消耗
和板温度

IS215UCVEM08B

IS215UCVEM08B
The Field Termination Unit (FTU) is the section of the I/O Module that connects all three FIUs to a single field interface. The FTU provides the Group Fail Safe Switches and passive components necessary for signal conditioning, over-voltage protection, and EMI/RFI filtering. When installed in a Trusted Controller or Expander Chassis, the FTU field connector interconnects to the Field I/O Cable Assembly attached at the rear of the Chassis. The SmartSlot link is passed from the HIU to the field connections via the FTU. These signals go directly to the field connector and maintain isolation from the I/O signals on the FTU. The SmartSlot link is the intelligent connection between Active and Standby Modules for coordination during Module replacement. 1.2.Field Interface Unit (FIU) The Field Interface Unit (FIU) is the section of the Module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Each Module has three FIUs, one per slice. For the TMR 24 Vdc Digital Output Module, the FIU contains one stage of the output switch structure, and sigma-delta (ΣΔ) output circuit for each of the 40 field outputs. Two additional ΣΔ circuits provide optional monitoring of the external field I/O supply voltage. Trusted TMR 24Vdc Digital Output Module – 40 Channel 1. Description Rockwell Automation Publication ICSTT-RM280N-EN-P Issue 14 5 The FIU receives isolated power from the HIU for logic. The FIU provides additional power conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25 Mbit/sec serial link connects each FIU to one of the HIU slices. The FIU also measures a range of on-board “housekeeping” signals that assist in monitoring the performance and operating conditions of the Module. These signals include power supply voltages, current consumption, on-board reference voltages and board temperature. 1.3. Host Interface Unit (HIU) The HIU is the point of access to the Inter-Module Bus (IMB) for the Module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O Module to directly connect to the IMB Backplane. The HIU is common to most high integrity I/O types and has type dependent and product range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C. All interconnections between the three slices incorporate isolation to help prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices. The HIU provides the following services common to the Modules in the family: • High Speed Fault Tolerant Communications with the TMR Processor via the IMB interface. • FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O Module data to the IMB. • Galvanically isolated serial data interface to the FIU slices. • Redundant power sharing of dual 24 Vdc chassis supply voltage and power regulation for logic power to HIU circuitry. • Magnetically isolated power to the FIU slices. • Serial data interface to the FPU for Module status LEDs. • SmartSlot link between Active and Standby Modules for co-ordination during Module replacement. • Digital Signal Processing to perform local data reduction and self-diagnostics. • Local memory resources for storing Module operation, configuration, and field I/O data. • On-board housekeeping, which monitors reference voltages, current consumption and board temperatur