5X00357G04模块备件

1C31222G01

和功能，同时保护
基本面投资
VMEbus及其相关技术
ƒ高达1.3GHz的片上系统NXP
带双PowerPC®e600的MPC864xD
处理器核心，双集成存储器
控制器、DMA引擎、PCI Express
接口、以太网和本地I/O
扩展温度（-40°C至+71°C）
和坚固的电路板变体
ƒ四个千兆以太网端口
ƒ多2GB的DDR2 ECC内存，128MB
NOR闪存和2GB、4GB或8GB NAND闪存
ƒUSB 2.0控制器，用于集成经济高效的外设（商用
仅限温度）
ƒ2具有20MB/s的SST VMEbus协议
跨VMEbus的传输速率
ƒ双33/66/100 MHz PMC-X站点，用于
通过行业标准模块扩展
支持处理器PMC
ƒ8x PCI Express扩展连接器
使用智能EC进行PMC-X和XMC扩展
XMCspan
ƒMVME7216E直接连接后过渡
模块（RTM），用于通过
VMEbus机箱
MVME7100
NXP®MPC864xD VME SBC
智能嵌入式计算MVME7100，具有片上系统MPC864xD
处理器，为具有上一代应用程序的VMEbus客户提供了增长路径
生成VME，特别是MPC74xx处理器。片上系统实现
提供电力/热、可靠性和生命周期优势，这些优势在替代产品中通常找不到
架构。
SMART EC MVME7100单板计算机（SBC）帮助工业、医疗、医疗和工业领域的原始设备制造商，
国防/航空设备增加了性能和功能，以获得竞争优势
同时仍然保护对VMEbus和相关技术的基本投资。
客户可以保留其VMEbus基础结构（机箱、背板和其他VMEbus以及
PMC板），同时提高性能并延长生命周期。此外，扩展
智能电子计算产品的生命周期有助于减少开发和支持中的流失
频繁的产品变更所带来的努力。
更快的处理器和2EST VMEbus接口相结合，提供了显著的性能
改善使用USB接口可以轻松集成新的经济高效的外设。
扩展温度（-40°C至+71°C）变体支持多种操作和
储存温度以及增加的冲击公差。这使董事会能够：
在恶劣环境中操作，同时保持结构和操作完整性。
D

1C31222G01

1C31222G01

and features while protecting the fundamental investment in VMEbus and related technologies ƒ Up to 1.3GHz system-on-chip NXP MPC864xD with dual PowerPC® e600 processor cores, dual integrated memory controllers, DMA engine, PCI Express interface, Ethernet, and local I/O ƒ Extended temperature (-40 °C to +71 °C) and rugged board variants available ƒ Four Gigabit Ethernet ports ƒ Up to 2GB of DDR2 ECC memory, 128MB NOR flash and 2GB, 4GB or 8GB NAND flash ƒ USB 2.0 controller for integrating costeffective peripherals (commercial temperature only) ƒ 2eSST VMEbus protocol with 20MB/s transfer rate across the VMEbus ƒ Dual 33/66/100 MHz PMC-X sites for expansion via industry standard modules with support for processor PMCs ƒ 8x PCI Express expansion connector for PMC-X and XMC expansion using SMART EC XMCspan ƒ MVME7216E direct-connect rear transition module (RTM) for I/O routing through rear of a VMEbus chassis MVME7100 NXP® MPC864xD VME SBC The SMART Embedded Computing MVME7100, featuring the system-on-chip MPC864xD processor, offers a growth path for VMEbus customers with applications on the previous generation of VME, specifically the MPC74xx processors. The system-on-chip implementation offers power/thermal, reliability, and lifecycle advantages not typically found in alternative architectures. The SMART EC MVME7100 single-board computer (SBC) helps OEMs of industrial, medical, and defense/aerospace equipment add performance and features for competitive advantage while still protecting the fundamental investment in VMEbus and related technologies. Customers can keep their VMEbus infrastructure (chassis, backplanes, and other VMEbus and PMC boards) while improving performance and extending the lifecycle. Also, the extended lifecycle of SMART EC computing products helps reduce churns in development and support efforts resulting from frequent product changes. The faster processor and 2eSST VMEbus interface combine to offer significant performance improvement. New cost-effective peripherals can be integrated easily using USB interfaces. Extended temperature (-40 °C to +71 °C) variants support a wide range of operating and storage temperatures in addition to increased tolerances for shock. This enables the boards to operate in harsh environments while maintaining structural and operational integrity. D