




1C31116G01
MVME7100添加:
性能和特点
同时保护
基本面投资
在VMEbus和相关
技术
高达1.3 GHz的片上系统
飞思卡尔MPC864xD带
二重的
PowerPC®e600处理器
核心,双集成
内存控制器,DMA
发动机
PCI Express接口,
以太网和本地I/O
扩展温度(-40°C)
至+71°C)
四个千兆以太网端口
多2GB的DDR2 ECC
内存,128MB NOR闪存
和4或8GB NAND闪存
USB 2.0控制器
整合成本效益
外围设备(商用
仅限温度)
2EST VMEbus协议
传输速率为320MB/s
跨VMEbus
板支持包
VxWorks、LynxOS和Linux
双33/66/100MHz PMC-X
通过扩展的站点
行业标准模块
支持处理器
私营军事公司
8倍PCI Express扩展
PMC-X和
XMC扩展使用
艾默生XMCspan
MVME7216E直接连接
后过渡模块(RTM)
用于通过后部的I/O路由
VMEbus机箱
1C31116G01

1C31116G01
The MVME7100 adds performance and features while protecting the fundamental investment in VMEbus and related technologies Up to 1.3 GHz system-on-chip Freescale MPC864xD with dual PowerPC® e600 processor cores, dual integrated memory controllers, DMA engine, PCI Express interface, Ethernet, and local I/O Extended temperature (-40 °C to +71 °C) Four Gigabit Ethernet ports Up to 2GB of DDR2 ECC memory, 128MB NOR flash and 4 or 8GB NAND flash USB 2.0 controller for integrating cost-effective peripherals (commercial temperature only) 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus Board support packages for VxWorks, LynxOS, and Linux Dual 33/66/100MHz PMC-X sites for expansion via industry standard modules with support for processor PMCs 8x PCI Express expansion connector for PMC-X and XMC expansion using Emerson XMCspan MVME7216E direct-connect rear transition module (RTM) for I/O routing through rear of a VMEbus chassis
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